Active components : SOIC, QFN/ML, BGA, SOT, QFP, DPAK, SiP, PoP
Passive Components & Discretes : SOT Packages, Capacitors, Inductors, Diodes, ESD Protection, Fuses
Bare Die : Micro Die, Wafer Level Packaging, Chip Scale Packaging, FIWLP, FOWLP, Stacked Die (2.5D & 3D)
LEDs : Low Power LEDs, Mid/High Power Packages, Domed Packages, LED Modules, Lenses, LED Die
Mechanicals : Connectors, Clips, Springs, Switches, Shields, Sockets, SiP, Modules
Specialty application : Bump, Interleaf, Spacer Tape,...
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